| Customization: | Available |
|---|---|
| Application: | Enterprise Level |
| Instruction System: | RISC |
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Production Description:
This is a 1U server cooling module that supports Intel Whitley LGA4189 platform radiator. With the system, the solvable power can be 280W. It is extruded with high-density fins to increase the heat dissipation area. It can provide a larger heat sink under the same form factor. The heat dissipation area, the material is AL6063, the product is more strong.
| CPU Socket | Intel Whitley LGA4189 | ||
| Application | 1U Server and Up ( Passive) | ||
| Dimension | 113*78*25.3mm | ||
| TDP | 200W | ||
| Material | AL Extrusion Fin Copper heat pipe | ||
| Thermal Grease | Shin-Etsu TC-5288 Pre-Applied | ||
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