Customization: | Available |
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Application: | Enterprise Level |
Instruction System: | RISC |
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Processor
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Up to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor
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Memory
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• 32 DDR4 DIMM slots, supports RDIMM 2 TB max or LRDIMM 8 TB max, speeds up to 3200 MT/s
• Up to 16 Intel Persistent Memory 200 series (BPS) slots, 8 TB max • Supports registered ECC DDR4 DIMMs only |
Storage controllers
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• Internal controllers: PERC H745, HBA355I, S150, H345, H755, H755N
• Boot Optimized Storage Subsystem (BOSS-S2): HW RAID 2 x M.2 SSDs 240 GB or 480 GB • Boot Optimized Storage Subsystem (BOSS-S1) HW RAID 2 x M.2 SSDs 240 GB or 480 GB • External PERC (RAID): PERC H840, HBA355E |
Drive Bays
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Front bays:
• Up to 12 x 3.5-inch SAS/SATA (HDD/SSD) max 192 TB • Up to 8 x 2.5-inch NVMe (SSD) max 122.88 TB • Up to 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 245.76 TB • Up to 24 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 368.84 TB Rear bays: • Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 30.72 TB • Up to 4 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 61.44 TB |
Power Supplies
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• 800 W Platinum AC/240 mixed mode
• 1100 W Titanium AC/240 mixed mode • 1400 W Platinum AC/240 mixed mode • 2400 W Platinum AC/240 mixed mode |
Cooling Options
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Air cooling, optional processor liquid cooling
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Fans
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• Standard fan/High performance SLVR fan/High performance GOLD fan
• Up to six hot plug fans |
Dimensions
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• Height - 86.8 mm (3.41 inches)
• Width - 482 mm (18.97 inches) • Depth - 758.3 mm (29.85 inches) - without bezel 772.14 mm (30.39 inches) - with bezel |
Form Factor
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2U rack server
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Embedded Management
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• iDRAC9
• iDRAC Service Module • iDRAC Direct • Quick Sync 2 wireless module |
Bezel
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Optional LCD bezel or security bezel
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OpenManage Software
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• OpenManage Enterprise
• OpenManage Power Manager plugin • OpenManage SupportAssist plugin • OpenManage Update Manager plugin |
Mobility
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OpenManage Mobile
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Security
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• Cryptographically signed firmware
• Secure Boot • Secure Erase • Silicon Root of Trust • System Lockdown (requires iDRAC9 Enterprise or Datacenter) • TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ |
Embedded NIC
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2 x 1 GbE LOM
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Network Options
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1 x OCP 3.0 (x8 PCIe lanes)
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GPU Options
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Up to two double-width 300 W, or four single-width 150 W, or six single-width 75 W accelerators
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PCIe
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Up to 8 x PCIe Gen4 slots (up to 6 x16) with support for SNAP I/O modules
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